NDT X-ray inspection images of a mobile phone acquired with the 16.8 Megapixel X-ray sCMOS detector
17th Mar, 2020
NDT X-ray inspection images of a mobile phone acquired with the 16.8 Megapixel X-ray sCMOS detector from Photonic Science. Integrated circuits, high density PCBs and electronic components connected via µm scale bond wires are clearly visible. Ball grid arrays and though-silicon vias are easily seen on a 6x magnified image. An oblique view reveals the…