News
NDT X-ray inspection images of a mobile phone acquired with the 16.8 Megapixel X-ray sCMOS detector
17th Mar, 2020
NDT X-ray inspection images of a mobile phone acquired with the 16.8 Megapixel X-ray sCMOS detector from Photonic Science. Integrated circuits, high density PCBs and electronic components connected via µm scale bond wires are clearly visible. Ball grid arrays and though-silicon vias are easily seen on a 6x magnified image. An oblique view reveals the integrity of these µm scale components for quality control inspection when the phone is fully assembled.
- Mobile phone single projection of Ball Grid Array(BGA)and bond wires, 4µm resolution at 6x geometric magnification
- X-ray Image of mobile phone, 13.5µm resolution with no geometric magnification
- Mobile phone oblique view of Ball Grid Array(BGA) and bond wires, 4µm resolution at 6x geometric magnification
16.8 Megapixel X-ray sCMOS detector
